Connectors up performance for LED bulbs and fixtures

The DF57H Series wire-to-board connector is capable of delivering 2.5 amps of current in a small 1.2 mm pitch, 1.4 mm mated height connector.  A swing lock produces a clear tactile click to ensure the mating process has been completed.  It features high contact lance strength and a low profile for connecting LED drivers to lighting fixtures.

The DF59 Series multi-functional connector can be configured to either work as a wire-to-board or board-to-board connector system. The 2.0 mm pitch connector has one common socket can mate to three different header styles. It is designed for linear SSL applications.

The DF61 Series connector features 2.2 mm pitch with a low-mated height of 2.38 mm.  It has high current capacity of 5 amps and a high voltage rating of 350 V AC/DC targeting LED light bulbs and LED tube fixtures.  The swing-lock connector header is molded as one solid piece to help prevent solder wicking.

The DF62 Series slim wire-to-wire connector is designed with small or confined spaces in mind. Features include a multi-row pin layout, smooth outside contour, no exposed metal on the outside of the housing, this series targets LED applications.  The two-point crimp contact design delivers a reliable connection that is resistant to shock and vibration. Contact company for pricing and delivery.

Adaptive forward lighting (i.e., glare-free camera-controlled headlamps that react instantly) will help drivers even more in the future thanks to additional intelligent functions. The key to this complex functionality is the integration of microelectronics and optoelectronics, one of the principal aspects of the research project sponsored by the German Federal Ministry of Education and Research (FMER) within the "Photonics Research Germany" program. Osram Opto Semiconductor is contributing its expertise as the project coordinator and market leader in light-emitting diode (LED) lighting for the automotive sector.

The aim of this joint project as part of the FMER "Integrated Microphotonics" initiative is to develop the technical framework for a new class of energy-efficient LED headlamps with supplementary traffic safety functions. This can provide the basis for adaptive forward lighting systems (AFS) that offer drivers and passengers increased safety. Improved safety will come, for example, from glare-free high-beam and low-beam that adapts to the speed of the vehicle. At high speed the range of the light is automatically increased. In city traffic, however, a wider distribution of the light can improve road safety by illuminating more of the sidewalk and margins. These functions are fully electronic so there is no need for mechanical actuators.

Osram Opto Semiconductors is bringing its expertise to this project as the project coordinator for the automotive sector. The semiconductor specialist has extensive know-how in chip and converter technologies. Osram's Specialty Lighting division will develop new electronic control gear for controlling the LED headlamp system. The Fraunhofer Institute for Reliability and Microintegration (IZM) is contributing its expertise in interconnection technology and materials and Infineon Technologies is offering its experience in automotive electronics and LED drivers.

The automotive industry supplier and lighting specialist Hella KGaA Hueck & Co. will develop the entire optical system for the LED module and the headlamps and will build the prototypes. Daimler, a major engineering powerhouse in the automotive sector, will carry out the vehicle tests.